cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 1/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification small signal schottky (double) diodes bar40n3/BAR40AN3 bar40cn3/bar40sn3 description planar silicon schottky barrier diodes encapsula ted in a sot-23 small plastic smd package. single diodes and double diodes with different pinning are available. features ? very small conduction losses ? low forward voltage drop ? small plastic smd package ?pb-free package applications ?ultra high-speed switching ? voltage clamping ?protection circuits ?blocking diodes pinning outline description pin bar40 bar40a bar40c bar40s 1 a k1 a1 a1 2 nc k2 a2 k2 3 k a1,a2 k1,k2 k1,a1 2 3 1 n.c. 12 3 1 2 3 3 2 1 sot-23 1 2 3 (1) bar40 (2)bar40a marking: type marking code bar40 n3 jv3 BAR40AN3 b6 (3)bar40c (4)bar40s bar40cn3 5c bar40sn3 ld3 diode configuration and symbol
cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 2/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification absolute maximum ratings ? maximum temperatures storage temperature tstg................................................................................................... . -65~+150 c junction temperature tj ..................................................................................................... ..-55~ +125 c ? maximum power dissipation total power dissipation (ta=25 c) ptot (note) ......................................................................... 350 mw ? maximum voltages and currents (ta=25 c) repetitive peak reverse voltage v rrm ............................................................................................... 40 v continuous forward current i f ................................................................................................... 200 ma repetitive peak forward current(tp 1s,duty cycle 0.5)???????????????? 300ma non-repetitive peak forward curre nt (tp<10ms, sinusoidal) i fsm ............................................... 600 ma note: for double diodes, ptot is the to tal power dissipation of both diodes. characteristics (ta=25 c) characteristic symbol condition min. max. unit reverse breakdown voltage v br i r =100 a 40 - v v f (1) i f =1ma - 320 mv forward voltage (note 1) v f (2) i f =40ma - 500 mv v f (3) i f =100ma - 550 mv reverse leakage current (note 2) i r v r =30v, tj=25 - 200 na diode capacitance c d v r =1v, f=1mhz - 10 pf reverse recovery time trr i f =i r =10ma r l =100 measured at i r =1ma - 5 ns notes : 1.pulse test, tp=380 s,duty cycle<2%. 2.pulse test, tp=5ms,duty cycle<2%.
cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 3/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification characteristic curves forward current & forward voltage 0 50 100 150 200 250 0 200 400 600 800 1000 forward voltage-v f (mv) forward current-i f (ma) diode capacitance & reverse-biased voltage 1 10 100 0.1 1 10 100 reverse biased voltage-v r (v) diode capacitance-cd (pf)
cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 4/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow pb-free assembly profile feature sn-pb eutectic assembly average ramp-up rate 3 c/second max. 3 c/second max. (tsmax to tp) preheat 100 c 150 c ? temperature min(t s min) ? temperature max(t s max) 150 c 200 c ? time(ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: ? temperature (t l ) 183 c 217 c ? time (t l ) 60-150 seconds 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. 6 minutes max. 8 minutes max. time 25 c to peak temperature note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 5/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification recommended footprint inches millimeters dim typ typ a 0.039 1.0 b 0.039 1.0 c 0.079 2.0 d 0.035 0.9 e 0.031 0.8
cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 6/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c302n3 issued date : 2011.06.27 revised date : 2012.02.07 page no. : 7/7 bar40n3/BAR40AN3/bar40cn3/bar40sn3 cystek product specification sot-23 dimension h j k d a l g v c b 3 2 1 s marking: diagram: l4_ xxx 3-lead sot-23 plastic surface mounted package. cystek package code: n3 ? bar40 n3: single diode. (marking code jv3) ? BAR40AN3: common anode. (marking code b6) ? bar40cn3: common cathode. (marking code 5c) ? bar40sn3: series connected. (marking code ld3) *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0034 0.0070 0.085 0.177 b 0.0472 0.0630 1.20 1.60 k 0.0128 0.0266 0.32 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1083 2.10 2.75 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0005 0.0040 0.013 0.10 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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